XC3S100E-4TQG144C

Product Summary

The XC3S100E-4TQG144C is a Field-Programmable Gate Array. The XC3S100E-4TQG144C is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The five-member family offers densities ranging from 100,000 to 1.6 million system gates. The XC3S100E-4TQG144C builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. These Spartan-3E enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Parametrics

XC3S100E-4TQG144C absolute maximum ratings: (1)VCCINT Internal supply voltage: –0.5 to 1.32 V; (2)VCCAUX Auxiliary supply voltage: –0.5 to 3.00 V; (3)VCCO Output driver supply voltage: –0.5 to 3.75 V; (4)VREF Input reference voltage: –0.5 to VCCO+0.5 V; (5)VIN Voltage applied to all User I/O pins and Dual-Purpose pins Driver in a high-impedance state: –0.5 to VCCO+0.5 V; (6)Voltage applied to all Dedicated pins: –0.5 to VCCAUX+0.5 V; (7)VESD Electrostatic Discharge Voltage Human body model: –2000 to +2000 V; (8)Charged device model: –500 to +500 V; (9)Machine model: –200 to +200 V; (10)TJ Junction temperature: - 125 ℃; (11)TSTG Storage temperature: –65 to 150 ℃.

Features

XC3S100E-4TQG144C features: (1)Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (2)Proven advanced 90-nanometer process technology; (3)Multi-voltage, multi-standard SelectIO interface pins; (4)Densities up to 33,192 logic cells, including optional shift register or distributed RAM support; (5)Efficient wide multiplexers, wide logic; (6)Eight global clocks and eight clocks for each half of device, plus abundant low-skew routing; (7)Configuration interface to industry-standard PROMs; (8)Complete Xilinx ISE, WebPACK development system support; (9)MicroBlaze, PicoBlaze embedded processor cores; (10)Fully compliant 32-/64-bit 33/66 MHz PCI support; (11)Low-cost QFP and BGA packaging options.

Diagrams